Complex electronics manufacturing. Purpose built in the UK.
The difference between a capable manufacturer and the right one becomes clear the moment your project gets complex.
We are built for the projects that expose every limitation in a standard manufacturing operation. Aerospace. Defence. Medical. Industrial. Automotive. Sectors where the tolerance for error is zero and the pressure to deliver is absolute.
Four decades of this work has shaped everything. Our engineers, our processes, our facility and the way we engage from the very first conversation.
You will work directly with people who understand your sector, who will challenge your design where it can be improved and who will own your outcome as if it were their own.
A different category of manufacturer
Trusted by the UK's most demanding customers
The organisations that trust us with their most complex, most critical, most unforgiving projects didn't arrive here by accident. They arrived here because every other option left something to be desired. We don't take that trust lightly. We take it as the standard we hold ourselves to. Every project. Every time.
Designed, built and owned in the UK.
We are one of the largest UK-owned electronics manufacturers in Britain. Not part of a global group. Not answerable to an offshore parent. Owned here. Invested here. Accountable here. Walk the floor, meet the team and see an operation built entirely around the standard your application demands.
A facility built for what's next
Vacuum vapour phase soldering. Solder jet printing. Robotic through hole. Hybrid PCB assembly. Flexible SMT. 3D AOI/AXI inspection. And one of the few dedicated RF Labs in UK electronics manufacturing. Every capability was chosen because the projects we take on demand it.
We're built different
Choosing TechPoint does not just solve your manufacturing challenge. It gives you access to specialist frequency control components and dedicated supply chain management within the same operation. When your production line needs components, there is no separate supplier to qualify. When your supply chain needs managing, there is no separate conversation to have. It is all here. We're built different to challenge what's possible.
From first prototype, to complex builds and volume manufacturing. We have the capability to own every stage
Complex PCB assembly
The board is where everything starts and where most things go wrong. We build complex, high-reliability PCBs to a standard that holds up in the environments our customers operate in. SMT, THT, mixed technology, high-density, fine-pitch. The same uncompromising process applied to every board, every run. Every assembly backed by our three year workmanship warranty.
Complex PCB assembly
The board is where everything starts and where most things go wrong. We build complex, high-reliability PCBs to a standard that holds up in the environments our customers operate in. SMT, THT, mixed technology, high-density, fine-pitch. The same uncompromising process applied to every board, every run. Every assembly backed by our three year workmanship warranty.
High speed, high precision placement
45,000 components per hour. Precision down to 50μm. 01005 chip components through large BGAs on the same line. Speed at volume without sacrificing the accuracy your assembly demands. Solder paste printing, placement, reflow, AOI and AXI built into the process, Not added at the end when it is too late to matter.
High speed, high precision placement
45,000 components per hour. Precision down to 50μm. 01005 chip components through large BGAs on the same line. Speed at volume without sacrificing the accuracy your assembly demands. Solder paste printing, placement, reflow, AOI and AXI built into the process, Not added at the end when it is too late to matter.
Precision through-hole assembly
Robotic selective soldering for through-hole components where consistency and repeatability are non-negotiable. Iron tip, laser and ultrasonic techniques applied with exact temperature control across complex mixed-technology boards. The same joint quality on unit one as unit ten thousand. For aerospace, defence and medical applications where manual soldering variability is simply not acceptable.
Precision through-hole assembly
Robotic selective soldering for through-hole components where consistency and repeatability are non-negotiable. Iron tip, laser and ultrasonic techniques applied with exact temperature control across complex mixed-technology boards. The same joint quality on unit one as unit ten thousand. For aerospace, defence and medical applications where manual soldering variability is simply not acceptable.
Complete product assembly
We do not stop at the board. PCB integration, cable and wiring harness assembly, mechanical fitting, firmware loading, functional testing and final validation. One team taking your product from bare PCB to a finished, tested, production-ready unit. No handoffs. No separate assembly house. No disconnection between the board build and the system build.
Complete product assembly
We do not stop at the board. PCB integration, cable and wiring harness assembly, mechanical fitting, firmware loading, functional testing and final validation. One team taking your product from bare PCB to a finished, tested, production-ready unit. No handoffs. No separate assembly house. No disconnection between the board build and the system build.
Finishing & protection
The steps between assembly and shipment that determine how your product survives in the field. Through-hole soldering, press-fit technology, conformal coating and encapsulation applied to the same standard as every stage that came before it. Not a separate process managed by a separate team. The same people, the same standard, all the way to the door.
Finishing & protection
The steps between assembly and shipment that determine how your product survives in the field. Through-hole soldering, press-fit technology, conformal coating and encapsulation applied to the same standard as every stage that came before it. Not a separate process managed by a separate team. The same people, the same standard, all the way to the door.
Turnkey. Redefined.
From component sourcing through PCB assembly, system build, testing and shipment. We manage the complexity so you do not have to. No supplier coordination. No gaps between processes. A finished, tested product delivered without the operational overhead of managing it yourself.
Turnkey. Redefined.
From component sourcing through PCB assembly, system build, testing and shipment. We manage the complexity so you do not have to. No supplier coordination. No gaps between processes. A finished, tested product delivered without the operational overhead of managing it yourself.
Equipment that enables precision at scale
Vapour phase, nitrogen & conventional reflow
We will specify the right one for your assembly, not the most convenient one for us. Vapour phase where uniform heating and minimal thermal stress are critical. Nitrogen atmosphere where oxidation cannot be tolerated and joint integrity is non-negotiable. Conventional convection where consistency and throughput at volume are the priority.
Solder jet printing
Non-contact solder paste deposition that is precise, programmable and ready to run within minutes of receiving bare boards. The right process for RF assemblies, HDI designs, QFN devices, Package-on-Package and cavity printing where standard stencil printing cannot get close enough. Better yields, reduced voids and none of the lead time or cost of stencil fabrication.
3D Automated Optical Inspection (AOI)
3D AOI uses multi-angle cameras and laser-based profiling to inspect every assembly at production speed. Solder defects, component misalignment and surface irregularities that 2D systems miss entirely. Not a sampling process. Every board, every time.
3D Automated X-ray Inspection (AXI)
3D AXI goes further. X-ray imaging reveals what optical inspection cannot. Hidden solder joints, internal voids, short circuits and head-in-pillow defects. Essential for BGAs, QFNs and bottom-terminated components where the joint is invisible to the eye.
Beyond the build
RF engineering & testing
One of the few dedicated RF Labs in UK electronics manufacturing. Built because our customers cannot afford to send assemblies elsewhere when RF performance and compliance are non-negotiable. Signal integrity, antenna performance, EMC compliance, RF shielding and wireless protocol validation for Bluetooth, Wi-Fi and cellular. In-house.
Inspection, testing & analysis
A defect found in the field costs more than the entire production run. We find it here instead. Visual inspection, 3D AOI, X-ray, in-circuit testing, functional testing and environmental stress screening at the right stage, not bolted on at the end. When something fails we investigate to the root cause.
Rework & repair
Not every assembly that arrives here is perfect. Component replacement, soldering rework, BGA reballing, trace repair and conformal coating removal and reapplication. The capability to recover assemblies other manufacturers walk away from. Failure analysis included because fixing the part without understanding why it failed is not good enough.
Conformal coating & environmental protection
Moisture, chemicals, temperature extremes, vibration, dust. Conformal coating is what stands between your assembly and the environment it operates in. Acrylic, silicone, polyurethane, epoxy and parylene applied by selective robotic coating, spraying or dipping to your exact specification. For assemblies where environmental resilience is not optional.
Quality you can hold us to.
We back our work with one of the most comprehensive warranty commitments in the industry. Not because we have to. Because the way we build means we can.
Ready to discuss your next project?
Whether you're prototyping a new design, scaling to volume production, or looking for a more capable UK manufacturing partner, we'd welcome the opportunity to review your requirements and provide a quote
